There are several features still to be implemented in Klipper. In no particular order:

Host user interaction

See if there is a better way to report errors. Octoprint sometimes doesn't highlight an error (one has to look in the terminal tab to find the error) and errors written to the log can be non-obvious to a user.
Improve gcode interface:
Provide a way to temporarily disable endstop checks so that a user can issue commands that potentially move the head past position_min/position_max.
Improve logging:
Possibly collate and report the statistics messages in the log in a more friendly way.
Possibly support a mechanism for the host to limit maximum velocity so that the mcu is never requested to step at a higher rate than it can support.

Safety features

Support loading a valid step range into the micro-controller software after homing. This would provide a sanity check in the micro-controller that would reduce the risk of the host commanding a stepper motor past its valid step range. To maintain high efficiency, the micro-controller would only need to check periodically (eg, every 100ms) that the stepper is in range.
Possibly support periodically querying the endstop switches and use multiple step ranges depending on the switch state. This would enable runtime endstop detection. (However, it's unclear if runtime endstop detection is a good idea because of spurious signals caused by electrical noise.)

Complete the host based simulator. It's possible to compile the micro-controller for a "host simulator", but that simulator doesn't do anything currently. It would be useful to expand the code to support more error checks, kinematic simulations, and improved logging.

Add documentation describing how to perform bed-leveling accurately in Klipper. Improve description of stepper phase based bed leveling.

Possibly support a "feed forward PID" that takes into account the amount of plastic being extruded. If the extrude rate changes significantly during a print it can cause heating bumps that the PID overcompensates for. The temperature change due to the extrusion rate could be modeled to eliminate these bumps and make the extrusion temperature more consistent.